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About the 3D-IC Alliance:

The 3D-IC Alliance is a consortium of integrated circuit designers, developers, and manufacturers. Its objective is to promote standards for three-dimensional integrated circuits (3D ICs) in order to accelerate their availability and acceptance. Industry-wide standards would allow virtually any semiconductor vendor to implement 3D technology.

The Alliance will publish specifications for ICs and/or wafers that are to be stacked and vertically integrated. Any ICs or wafers that are processed and designed to these standards should be 3D integratable by most (if not all) Alliance members. The Alliance may also work to produce specific protocols and signaling and electrical specifications to allow broad adoption and interchange between various die-level or wafer-level vendors.

The initial focus for the Alliance is standardization of the vertical interconnect requirements. These specifications will include a minimum set of global rules for pad sizing and spacing, interconnect keepout requirements, and material restrictions or requirements. The specifications should accommodate embedded interconnect systems as well as various methods for adding backside or frontside interconnect.

Membership applications are welcome! The application form is here.

For other inquiries, send e-mail to:   info@3D-IC.org

3D-IC Alliance Founding Members:

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