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Upcoming 3D Events
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3D All
Silicon System Integration (3DASSI)
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March
11-12, 2008, Atlanta, Georgia
Silicon
substrates, TSV, thermal issues, etc.
http://www.prc.gatech.edu/events/3dassi/index.htm
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4th
International Conference and Exhibition on Device Packaging (IMAPS)
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March
17-20, 2008, Scottsdale, Arizona
Includes workshop on 3D
http://www.imaps.org/devicepackaging/
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58th Electronic Components and
Technology Conference (ECTC)
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May 17-30, 2008,
Lake Buena Vista, Florida
Includes advanced packaging and interconnects
http://www.ectc.net/ABOUT/2008/index.cfm
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11th Annual IEEE International
Interconnect Technology Conference (IITC 2008)
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June 1-4, 2008,
Burlingame, California
Focus on 3D: Processes, Integration, Interconnect Systems, etc.
http://www.his.com/~iitc/
Recent 3D Events
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Technology
Venture Fall Forum (RTI)
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October 22-24,
2007, Burlingame, California
Fourth annual "3D Architectures for Semiconductor
Integration and Packaging"
http://techventure.rti.org/fall2007/
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Thermal and Design Issues in 3D
ICs (SEMATECH Workshop)
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October 11-12, 2007, Albany, New
York
IC manufacturers, materials suppliers, CAD suppliers and users, 3D-TSV researchers
http://www.sematech.org/corporate/news/releases/20070924.htm
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24th VMIC (The Original Interconnect Conference)
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September 24 - 27, 2007, Fremont,
California
Included 3D-ICs, 3-D Systems, 3-D system- on- chip, vertical integration, wafer level
packaging
http://www.imic.org/2007-VMIC/index.html
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ITRS Summer Public Conference
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July 18, 2007, San Francisco, California
The roadmap for 3D interconnects was discussed under "Beyond Copper and Low-K"
http://www.itrs.net/Links/2007Summer/2007_Public_SF.htm
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MIT Club Event
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June 14, 2007, Palo Alto, CA
"Good Things Come in Small Packages: Advanced Chip Packaging"
| IEEE International
Interconnect Technology Conference (IITC 2007)
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June 3-6, 2007, San Francisco, California
3D-ICs were featured in the last three sessions of the conference.
http://www.his.com/~iitc/
| IMAPS 3rd International Conference
& Exhibition on Device Packaging
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March 19-22,
2007, Scottsdale, Arizona; featured workshops on 3D Packaging
http://www.imaps.org/devicepackaging/
© 2005-2008 3D-IC Alliance. All rights reserved. Revised: February 22, 2008
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