Events

Home
Standards
Literature
Events
Membership
Search

Upcoming 3D Events

bullet

Global Interconnect Technology Workshop (GIT)
5-8 November 2014, Atlanta GA

bullet

International Wafer-Level Packaging Conference (IWLPC)
Includes panel: System-level Advantages of 3D Integration
11-13 November 2014, San Jose, CA

bullet

IEEE International Conference on 3D System Integration (3DIC)
1-3 December 2014, Kinsale, Cork, Ireland

bullet

3D Architectures for Semiconductor Integration and Packaging (3D ASIP)
Keynote: "How 3D IC Standards Will Enable a New Growth Paradigm"
10-12 December 2014, Burlingame, CA

bullet

European 3D TSV Summit
19-21 January 2015, Grenoble, France

bullet

International Solid-State Circuits Conference (ISSCC)
22-26 February 2015, San Francisco, CA

bullet

Design, Automation, and Test in Europe (DATE)
9-13 March 2015, Grenoble, France

bullet

International Symposium on Quality Electronic Design (ISQED)
16-18 March 2015, Santa Clara, CA

bullet

IMAPS Device Packaging Conference
17-19 March 2015, Scottsdale/Fountain Hills, AZ

bullet

SEMICON Southeast Asia
22-24 April 2015, Penang, Malaysia

bullet

Electronic Design Process Symposium (EDPS)
23-24 April 2015, Monterey, CA

bullet

SEMI Advanced Semiconductor Manufacturing Conference (ASMC)
Includes 3D/TSV/Interposer 
3-6 May 2015, Saratoga Springs, NY

bullet

International Interconnect Technology Conference (IITC) / Advanced Metallization Conference (AMC))
18-21 May 2015, Grenoble, France

bullet

CMOS Emerging Technologies Research (CMOSETR)
20-22 May 2015, Vancouver BC, Canada

bullet

Electronic Components and Technology Conference (ECTC)
Several major topics are 3D and 2.5D related
26-29 May 2015, San Diego, CA

bullet

SEMICON West
14-16 July 2015, San Francisco, CA

Recent 3D Events

bullet

3D Test Workshop
23-24 October 2014, Seattle, WA

bullet

MEPTEC Semiconductor Packaging Technology Symposium
"Pushing the Limits in Packaging Design and Manufacturing"
23 October 2014, Santa Clara, CA

bullet

MemCon
Included 3D and 2.5D sessions
15 October 2014, Santa Clara, CA

bullet

International Symposium on Microelectronics (IMAPS)
"The Future of Packaging" - 35+ presentations on interposers and 3D
13-16 October 2014, San Diego, CA

bullet

Electronics Packaging Symposium and 2.5D/3D Workshop
8-9 October 2014, Binghamton, NY

bullet

SEMICON Europa and Advanced Packaging Conference
7-9 October 2014, Dresden, Germany

bullet

IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S)
6-9 October 2014, Millibrae CA

bullet

Evolving Technologies Summit at SMTA International
29 September 2014, Rosemont, IL

bullet

Electronic System-Integration Technology Conference (ESTC)
16-18 September 2014, Helsinki, Finland

bullet

Workshop on CMOS Active Pixel Sensors for Particle Tracking (CPIX14)
15-17 September 2014, Bonn, Germany

bullet

Image Sensors Americas
Included "Stacked Chip Sensors - Is There Any Going Back From Here?"
9-11 September 2014, San Francisco, CA

bullet

SEMICON Taiwan
included 3D IC & Substrate Pavilion
3-5 September 2014, Taiwan

bullet

IEEE International System-on-Chip Conference
3-5 September 2014, Las Vegas, NV

bullet

Advanced Packaging & System Integration Technology Symposium
28 August 2014, Wuxi, China

bullet

International Conference on Electronic Packaging Technology (ICEPT)
12-15 August 2014, Chengdu, China

bullet

INFIERI Summer School
15-25 July 2014, Paris, France

bullet

SEMICON West
8-10 July 2014, San Francisco, CA

bullet

Design for 3D Integration (D43D)
23-24 June 2014, Lausanne, Switzerland

© 2005-2014 3D-IC Alliance. All rights reserved.  Revised: November 05, 2014
 
Contact:  info@3D-IC.org