3D-IC Alliance

Home
Standards
Literature
Events
Membership
Search

Upcoming 3D Events

bullet

IEEE International System-on-Chip Conference
6-9 September 2016, Seattle, WA

bullet

European MEMS Summit
15-16 September 2016, Stuttgart, Germany

bullet

IMAPS: Advances in Semiconductor Packaging
22 September 2016, Marcy, NY

bullet

International Microelectronics Assembly and Packaging (IMAPS)
10-13 October 2016, Pasadena, CA

bullet

IEEE SOI-3D-Subthreshold (S3S) Microelectronics Technology Unified Conference
10-13 October 2016, Burlingame, CA

bullet

International Wafer-Level Packaging Conference (IWLPC)
18-20 October 2016, San Jose, CA

bullet

IEEE International Conference on 3D System Integration (IEEE 3DIC)
8-10 November 2016, San Francisco, CA

bullet

Electronics Packaging Technology Conference (EPTC)
30 Nov. - 3 Dec. 2016, Singapore

bullet

International Electron Devices Meeting (IEDM)
3-7 December 2016, San Francisco, CA

bullet

3D Architectures for Semiconductor Integration and Packaging (3D ASIP)
13-15 December 2016, San Francisco, CA

bullet

IEEE International Solid-State Circuits Conference (ISSCC)
5-9 February 2017, San Francisco, CA

bullet

Pan Pacific Microelectronics Symposium
6-9 February 2017, Kauai, Hawaii

bullet

IMAPS Device Packaging Conference
6-9 March 2017

bullet

Design, Automation, and Test in Europe (DATE)
27-31 March 2017, Lausanne, Switzerland

bullet

International Symposium on Quality Electronic Design (ISQED)
March 2017, Santa Clara, CA

Recent 3D Events

bullet

SEMICON West
12-14 July 2016, San Francisco, CA

bullet

2016 Symposia on VLSI Technology and Circuits
13-17 June 2016, Honolulu, HI

bullet

3D Power Electronics Integration and Manufacturing
13-15 June 2016, Raleigh, NC

bullet

The ConFab
12-15 June 2016, Las Vegas, NV

bullet

Electronic Components and Technology Conference (ECTC)
Several major topics are 3D and 2.5D related
31 May - 3 June 2016, Las Vegas, NV

bullet

CMOS Emerging Technologies Research (CMOSETR)
25-27 May 2016, Montreal QC, Canada

bullet

International Interconnect Technology Conference (IITC) / Advanced Metallization Conference (AMC)
23-26 May 2016, San Jose, CA

bullet

Advanced CMOS Technology 2016 (the 20/14/10 nm nodes)
18-20 May 2016, San Jose, CA

bullet

SEMI Advanced Semiconductor Manufacturing Conference (ASMC)
Includes 3D/TSV/Interposer: Packaging and Through Silicon Via
16-19 May 2016, Saratoga Springs, NY

bullet

Advanced Packaging: A Changing Landscape
10 May 2016, webcast

bullet

Electronic Design Process Symposium (EDPS)
21-22 April 2016, Monterey, CA

bullet

Advanced Packaging and System Integration Technology Symposium
21-22 April 2016, Wuxi, China

bullet

International Conference on Architecture of Computing Systems (ARCS)
47 April 2016, Nuremberg, Germany

2005-2016 3D-IC Alliance. All rights reserved.  Revised: July 14, 2016
 
Contact:  info@3D-IC.org