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Upcoming 3D Events

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IEEE International Conference on 3D System Integration (IEEE 3DIC)
8-10 November 2016, San Francisco, CA

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Semiconductor Packaging Roadmap Symposium
Featuring the new Heterogeneous Integration Roadmap (HIR)
14 November 2016, San Jose, CA

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Electronics Packaging Technology Conference (EPTC)
30 Nov. - 3 Dec. 2016, Singapore

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International Electron Devices Meeting (IEDM)
3-7 December 2016, San Francisco, CA

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3D Architectures for Semiconductor Integration and Packaging (3D ASIP)
13-15 December 2016, San Francisco, CA

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European 3D Summit
2325 January 2017, Grenoble, France

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IEEE International Solid-State Circuits Conference (ISSCC)
5-9 February 2017, San Francisco, CA

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Pan Pacific Microelectronics Symposium
6-9 February 2017, Kauai, Hawaii

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IMAPS Device Packaging Conference
6-9 March 2017, Fountain Hills, AZ

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Design, Automation, and Test in Europe (DATE)
27-31 March 2017, Lausanne, Switzerland

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International Symposium on Quality Electronic Design (ISQED)
March 2017, Santa Clara, CA

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The ConFab
14-17 May 2017, San Diego, CA

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SEMI Advanced Semiconductor Manufacturing Conference (ASMC)
Includes 3D/TSV: Packaging and Through Silicon Via
15-18 May 2017, Saratoga Springs, NY

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International Interconnect Technology Conference (IITC)
16-18 May 2017, Hsinchu, Taiwan

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Emerging Technologies Conference (ET CMOS)
28-30 May 2017, Warsaw, Poland

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Electronic Components and Technology Conference (ECTC)
30 May - 2 June 2017, Lake Buena Vista, FL

Recent 3D Events

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Advanced Packaging Conference (part of SEMICON Europa)
25-26 October 2016, Grenoble, France

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International Wafer-Level Packaging Conference (IWLPC)
18-20 October 2016, San Jose, CA

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IEEE SOI-3D-Subthreshold (S3S) Microelectronics Technology Unified Conference
10-13 October 2016, Burlingame, CA

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International Microelectronics Assembly and Packaging (IMAPS)
10-13 October 2016, Pasadena, CA

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IMAPS: Advances in Semiconductor Packaging
22 September 2016, Marcy, NY

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European MEMS Summit
15-16 September 2016, Stuttgart, Germany

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SEMICON Taiwan
Advanced packaging named a "hot topic"
7-9 September 2016, Taipei, Taiwan

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IEEE International System-on-Chip Conference
6-9 September 2016, Seattle, WA

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SEMICON West
12-14 July 2016, San Francisco, CA

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2016 Symposia on VLSI Technology and Circuits
13-17 June 2016, Honolulu, HI

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3D Power Electronics Integration and Manufacturing
13-15 June 2016, Raleigh, NC

2005-2016 3D-IC Alliance. All rights reserved.  Revised: November 04, 2016
 
Contact:  info@3D-IC.org