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Upcoming 3D Events

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SEMICON West
8-10 July 2014, San Francisco, CA

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INFIERI Summer School
15-25 July 2014, Paris, France

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International Conference on Electronic Packaging Technology (ICEPT)
12-15 August 2014, Chengdu, China

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IEEE International System-on-Chip Conference
3-5 September 2014, Las Vegas, NV

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SEMICON Europa and Advanced Packaging Conference
9-11 October 2014, Dresden, Germany

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International Symposium on Microelectronics (IMAPS)
13-16 October 2014, San Diego, CA

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International Wafer-Level Packaging Conference (IWLPC)
11-13 November 2014, San Jose CA

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IEEE International Conference on 3D System Integration (3DIC)
1-3 December 2014, Kinsale, Cork, Ireland

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3D Architectures for Semiconductor Integration and Packaging (3D ASIP)
10-12 December 2014, Burlingame, CA

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International Solid-State Circuits Conference (ISSCC)
22-26 February 2015, San Francisco, CA

Recent 3D Events

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Design for 3D Integration (D43D)
23-24 June 2014, Lausanne, Switzerland

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Design Automation Conference (DAC)
1-5 June 2014, San Francisco, CA

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Electronic Components and Technology Conference (ECTC)
27-30 May 2014, Lake Buena Vista, FL

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International Interconnect Technology Conference (IITC) / Advanced Metallization Conference (AMC))
20-23 May 2014, San Jose, CA

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SEMI Advanced Semiconductor Manufacturing Conference (ASMC)
19-21 May 2014, Saratoga Springs, NY

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SEMICON Singapore
3D Integration, TSVs, 3D-IC Technology & Manufacturing 
23-25 April 2014, Singapore

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Electronic Design Process Symposium (EDPS)
Includes 3D IC System Stacking
17-18 April 2014, Monterey, CA

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Design, Automation, and Test in Europe (DATE)
Includes one-day workshop on 3D
24-28 March 2014, Dresden, Germany

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SEMICON China 2014
Includes session on Advance Packaging, More than Moore
18-20 March 2014, Shanghai, China

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IMAPS Device Packaging Conference
10-13 March 2014, Scottsdale/Fountain Hills, AZ

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International Symposium on Quality Electronic Design (ISQED)
10-12 March 2014, Santa Clara, CA

2005-2014 3D-IC Alliance. All rights reserved.  Revised: July 01, 2014
 
Contact:  info@3D-IC.org