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Upcoming 3D Events

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International Conference on Electronic Packaging Technology (ICEPT)
11-14 August 2015, Changsha, China

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IEEE International 3D System Integration Conference (3DIC)
31 August - 2 September 2015, Sendai, Japan

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Image Sensors Americas
8-10 September 2015, Berkeley, CA

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IEEE International System-on-Chip Conference
8-11 September 2015, Beijing, China

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European Microelectronics and Packaging Conference (EMPC)
14-16 September 2015, Friedrichshafen, Germany

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Electronics Packaging Symposium: "Technology Advances in Small Scale Systems & Microelectronics Packaging"
15-16 September 2015, Niskayuna, NY

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IMAPS: Advances in Semiconductor Packaging
24 September 2015, Marcy, NY

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IEEE SOI-3D-Subthreshold (S3S) Microelectronics Technology Unified Conference
5-8 October 2015, Sonoma Valley, CA

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Advanced Packaging Conference (APC): "Interconnects in Miniaturized Systems"
6-7 October 2015, Dresden, Germany

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International Wafer-Level Packaging Conference (IWLPC)
13-15 October 2015, San Jose, CA

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International Microelectronics Assembly and Packaging (IMAPS)
26-29 October 2015, Orlando, FL

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Global Interposer Technology Workshop (GIT)
4 November 2015, Atlanta, GA

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MEPTEC/SEMI Symposium, The Great Miniaturization: Systems and Packaging
10-11 November 2015, Santa Clara, CA

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SC15: IEEE Supercomputing Conference
(International Conference for High Performance Computing, Networking, Storage and Analysis)
15-20 November 2015, Austin, TX

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Electronic Packaging Technology Conference (EPTC)
2-4 December 2015, Singapore

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3D Architectures for Semiconductor Integration and Packaging (3D ASIP)
15-17 December 2015, Redwood City, CA

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European 3D Summit 2016, Above and Beyond TSV
18-20 January 2016, Grenoble, France

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Pan Pacific Microelectronics Symposium
25-28 January 2016, Big Island, Hawaii

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IEEE International Solid-State Circuits Conference (ISSCC)
31 January - 4 February 2016, San Francisco, CA

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Design, Automation, and Test in Europe (DATE)
14-18 March 2016, Dresden, Germany

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International Symposium on Quality Electronic Design (ISQED)
March 2016, Santa Clara, CA

Recent 3D Events

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Advanced Semiconductor Technology Conference (ASTC)
27-28 July 2015, Singapore

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International Symposium on Low Power Electronics and Design (ISLPED)
22-24 July 2015, Rome, Italy

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SEMICON West
13-16 July 2015, San Francisco, CA

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International Technical Conference & Exhibition on Packaging & Integration of Electronic & Photonic Microsystems (InterPACK)
6-9 July 2015, San Francisco, CA

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Design Workshop for 3D Silicon Integration (D43D)
22-23 June 2015, Grenoble, France

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Electronic Components and Technology Conference (ECTC)
Several major topics are 3D and 2.5D related
26-29 May 2015, San Diego, CA

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CMOS Emerging Technologies Research (CMOSETR)
20-22 May 2015, Vancouver BC, Canada

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The ConFab
19-22 May 2015, Las Vegas, NV

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International Interconnect Technology Conference (IITC) / Advanced Metallization Conference (AMC))
18-21 May 2015, Grenoble, France

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SEMI Advanced Semiconductor Manufacturing Conference (ASMC)
Includes 3D/TSV/Interposer 
3-6 May 2015, Saratoga Springs, NY

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Electronic Design Process Symposium (EDPS)
23-24 April 2015, Monterey, CA

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SEMICON Southeast Asia
22-24 April 2015, Penang, Malaysia

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Advanced CMOS Technology
20-22 April 2015, San Jose, CA

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Symposium 3D Integration - Technology, Materials, Reliability
16 April 2015, Dresden, Germany

2005-2015 3D-IC Alliance. All rights reserved.  Revised: July 29, 2015
 
Contact:  info@3D-IC.org