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Upcoming 3D Events

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International Solid-State Circuits Conference (ISSCC)
9-13 February 2014, San Francisco, CA

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International Symposium on Quality Electronic Design (ISQED)
10-12 March 2014, Santa Clara, CA

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IMAPS Device Packaging Conference
11-13 March 2014, Scottsdale/Fountain Hills, AZ

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Design, Automation, and Test in Europe (DATE)
Includes one-day workshop on 3D
24-28 March 2014, Dresden, Germany

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IEEE International System-on-Chip Conference
3-5 September 2014, Las Vegas, NV

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SEMICON Europa and Advanced Packaging Conference
9-11 October 2014, Dresden, Germany

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International Symposium on Microelectronics (IMAPS)
13-16 October 2014, San Diego, CA

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International Wafer-Level Packaging (IWLPC)
11-13 November 2014, San Jose CA

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3D Architectures for Semiconductor Integration and Packaging (3D ASIP)
10-12 December 2014, Burlingame, CA

Recent 3D Events

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European 3D TSV Summit
20-22 January 2014, Grenoble, France

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3D Architectures for Semiconductor Integration and Packaging (3D ASIP)
11-13 December 2013, Burlingame, CA

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International Wafer-Level Packaging (IWLPC)
5-7 November 2013, San Jose, CA

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2013 International Conference on Electronic Packaging Technology
11-14 August 2013, Dalian, China

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INFIERI: First International Summer School
Included a half-day on 3D integration
10-16 July 2013, Oxford, UK

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SEMICON West
9-11 July 2013, San Francisco, CA

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The ConFab
23-26 June 2013, Las Vegas, NV

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International Interconnect Technology Conference (IITC)
13-15 June 2013, Kyoto, Japan

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Symposia on VLSI Technology & Circuits
11-14 June 2013, Kyoto, Japan

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Design Automation Conference (DAC)
Special Session: "3D-IC Design: Where Are We Going from Here?
2-6 June 2013, Austin, TX

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Electronic Components and Technology Conference (ECTC)
28-31 May 2013, Las Vegas, NV

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SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2013)
14-16 May 2013, Saratoga Springs, NY

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SEMICON Singapore
7-9 May 2013, Singapore

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GSA Silicon Summit
18 April 2013, Mountain View, CA

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Electronic Design Process Symposium (EDPS)
11-12 April 2013, Monterey, CA

2005-2014 3D-IC Alliance. All rights reserved.  Revised: January 28, 2014
 

Contact:  info@3D-IC.org