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Upcoming 3D Events

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Advanced CMOS Technology
20-22 April 2015, San Jose, CA

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SEMICON Southeast Asia
22-24 April 2015, Penang, Malaysia

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Electronic Design Process Symposium (EDPS)
23-24 April 2015, Monterey, CA

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SEMI Advanced Semiconductor Manufacturing Conference (ASMC)
Includes 3D/TSV/Interposer 
3-6 May 2015, Saratoga Springs, NY

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International Interconnect Technology Conference (IITC) / Advanced Metallization Conference (AMC))
18-21 May 2015, Grenoble, France

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The ConFab
19-22 May 2015, Las Vegas, NV

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CMOS Emerging Technologies Research (CMOSETR)
20-22 May 2015, Vancouver BC, Canada

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Electronic Components and Technology Conference (ECTC)
Several major topics are 3D and 2.5D related
26-29 May 2015, San Diego, CA

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Design Workshop for 3D Silicon Integration (D43D)
22-23 June 2015, Grenoble, France

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International Technical Conference & Exhibition on Packaging & Integration of Electronic & Photonic Microsystems (InterPACK)
6-9 July 2015, San Francisco, CA

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SEMICON West
14-16 July 2015, San Francisco, CA

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International Symposium on Low Power Electronics and Design (ISLPED)
22-24 July 2015, Rome, Italy

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International Conference on Electronic Packaging Technology (ICEPT)
11-14 August 2015, Changsha, China

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Image Sensors Americas
8-10 September 2015, Berkeley, CA

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IEEE International System-on-Chip Conference
8-11 September 2015, Beijing, China

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European Microelectronics and Packaging Conference (EMPC)
14-16 September 2015, Friedrichshafen, Germany

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IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference
5-8 October 2015, Sonoma Valley, CA

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Advanced Packaging Conference (APC) "Interconnects in Miniaturized Systems"
6-7 October 2015, Dresden, Germany

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International Wafer-Level Packaging Conference (IWLPC)
13-15 October 2015, San Jose, CA

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International Microelectronics Assembly and Packaging (IMAPS)
26-29 October 2015, Orlando, FL

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Global Interposer Technology Workshop (GIT)
4 November 2015, Atlanta, GA

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Electronic Packaging Technology Conference (EPTC)
2-4 December 2015, Singapore

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3D Architectures for Semiconductor Integration and Packaging (3D ASIP)
(date to be deteremined) Burlingame, CA

Recent 3D Events

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Symposium 3D Integration - Technology, Materials, Reliability
16 April 2015, Dresden, Germany

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IMAPS Device Packaging Conference
16-19 March 2015, Scottsdale/Fountain Hills, AZ

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International Symposium on Quality Electronic Design (ISQED)
16-18 March 2015, Santa Clara, CA

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Design, Automation, and Test in Europe (DATE)
included 3D Integration Workshop
9-13 March 2015, Grenoble, France

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International Solid-State Circuits Conference (ISSCC)
22-26 February 2015, San Francisco, CA

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SMTA Pan Pacific Symposium
Keynotes and sessions on 3D
2-5 February 2015, Kauai, HI

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European 3D TSV Summit
19-21 January 2015, Grenoble, France

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IEEE International Electron Devices Meeting (IEDM)
pre-meeting short course 3D System Integration Technology plus several sessions relating to 3D
15-18 December 2014, San Francisco, CA

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3D Architectures for Semiconductor Integration and Packaging (3D ASIP)
Keynote: "How 3D IC Standards Will Enable a New Growth Paradigm"
10-12 December 2014, Burlingame, CA

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IEEE International Conference on 3D System Integration (3DIC)
1-3 December 2014, Kinsale, Cork, Ireland

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International Wafer-Level Packaging Conference (IWLPC)
Includes panel: System-level Advantages of 3D Integration
11-13 November 2014, San Jose, CA

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Global Interconnect Technology Workshop (GIT)
5-8 November 2014, Atlanta GA

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3D Test Workshop
23-24 October 2014, Seattle, WA

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MEPTEC Semiconductor Packaging Technology Symposium
"Pushing the Limits in Packaging Design and Manufacturing"
23 October 2014, Santa Clara, CA

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MemCon
Included 3D and 2.5D sessions
15 October 2014, Santa Clara, CA

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International Symposium on Microelectronics (IMAPS)
"The Future of Packaging" - 35+ presentations on interposers and 3D
13-16 October 2014, San Diego, CA

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Electronics Packaging Symposium and 2.5D/3D Workshop
8-9 October 2014, Binghamton, NY

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SEMICON Europa and Advanced Packaging Conference
7-9 October 2014, Dresden, Germany

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IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S)
6-9 October 2014, Millibrae CA

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INFIERI Summer School
15-25 July 2014, Paris, France

2005-2015 3D-IC Alliance. All rights reserved.  Revised: April 20, 2015
 
Contact:  info@3D-IC.org