Electronic Design Process Symposium (EDPS)
11-12 April 2013, Monterey, CA

GSA Silicon Summit
18 April 2013, Mountain View, CA

SEMICON Singapore
7-9 May 2013, Singapore

SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2013)
14-16 May 2013, Saratoga Springs, NY

Electronic Components and Technology Conference (ECTC)
28-31 May 2013, Las Vegas, NV

Symposia on VLSI Technology & Circuits
11-14 June 2013, Kyoto, Japan

International Interconnect Technology Conference (IITC)
13-15 June 2013, Kyoto, Japan

SEMICON West
9-11 July 2013, San Francisco, CA

INFIERI: First International Summer School
Includes a half-day on 3D integration
10-16 July 2013, Oxford, UK

2013 International Conference on Electronic Packaging Technology
11-14 August 2013, Dalian, China

IMAPS Device Packaging Conference
12-14 March 2013, Scottsdale, AZ

International Symposium on Quality Electronic Design (ISQED)
4-6 March 2013, Santa Clara, CA

International Solid-State Circuits Conference (ISSCC)
17-21 February 2013, San Francisco, CA

European 3D TSV Summit
22-23 January 2013, Grenoble, France

3-D Architectures for Semiconductor Integration and Packaging (3D ASIP)
12-14 December 2012, Redwood City, CA

Electrical Design of Advanced Packaging and Systems (EDAPS)
9-11 December 2012, Taiwan

Electronics Packaging Technology Conference (EPTC)
5-7 December, 2012, Singapore

Microelectronics, Systems and Packaging for Medical applications
"3D packaging & interconnection" is a major topic 
4-5 December 2012, Paris, France

Global Interposer Technology Workshop (GIT 2012)
14-16 November 2012, Atlanta, GA

MEPTEC: Roadmaps for Multi Die Integration
14 November 2012, Santa Clara, CA

3D-Test (International Workshop on Testing Three-Dimensional Stacked Integrated Circuits)
8-9 November 2012, Anaheim, CA

IWLPC (International Wafer-Level Packaging Conference)
Includes 3D Integration track
5-8 November 2012, Santa Clara, CA

ICCAD (International Conference on Computer Aided Design)
Includes several 3D talks
5-8 November 2012, San Jose, CA

Connect in 3D Collaboration Summit
31 October - 1 November 2012, Palm Springs, CA

North America Standards Fall 2012 Meetings
Includes Three-Dimensional Stacked Integrated Circuits (3DS-IC)
29 October - 1 November 2012, San Jose, CA (also online)

International System-on-Chip Conference (10th SoC)
Includes panel: "3-D ICs... Technologies, Trends, Possibilities, and Challenges."
24-25 October 2012, Irvine, CA

IEEE - EPEPS 2012 (Electrical Performance  of Electronic Packaging and Systems)
21-24 October 2012, Tempe, AZ

SEMICON Europa 2012 and Advanced Packaging Conference
9-11 October 2012, Dresden, Germany

IEEC Electronics Packaging Symposium
9-10 October 2012, Niskayuna, NY

MEPTEC/SMTA Medical Electronics Symposium
Includes "3D Micro-packaging"
26-27 September 2012, Tempe, AZ

International Semiconductor Conference Dresden-Grenoble (ISCDG)
Includes "More than Moore Technologies" and "Interconnection and Packaging Technologies"
24-26 September 2012, Grenoble, France

Chip-Packaging Co-Design for High Performance Electronic Systems
24-25 September 2012, Santa Clara, CA

European Solid-State Device Research Conference (ESSDERC 2012)
Includes Process & Integration for 3D-IC
17-21 September 2012, Bordeaux, France

International Symposium on Microelectronics (IMAPS 2012)
Features 3D-IC keynote, technical track, exhibitor "power hour," and panel
9-13 September 2012, San Diego, CA

IEEE Custom Integrated Circuits Conference (CICC)
Includes "Advances in 3D Design and Optimization"
9-12 September 2012, San Jose, CA

SEMICON Taiwan 2012
included Advanced Packaging/Testing Pavilion and SiP Global Summit
5-7 September 2012, Taipei, Taiwan