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Upcoming 3D Events

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IMAPS Device Packaging Conference
14-17 March 2016, Fountain Hills, AZ

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Design, Automation, and Test in Europe (DATE)
14-18 March 2016, Dresden, Germany

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International Symposium on Quality Electronic Design (ISQED)
March 2016, Santa Clara, CA

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International Conference on Architecture of Computing Systems (ARCS)
47 April 2016, Nuremberg, Germany

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Electronic Design Process Symposium (EDPS)
21-22 April 2016, Monterey, CA

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SEMI Advanced Semiconductor Manufacturing Conference (ASMC)
Includes 3D/TSV/Interposer: Packaging and Through Silicon Via
16-19 May 2016, Saratoga Springs, NY

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International Interconnect Technology Conference (IITC) / Advanced Metallization Conference (AMC))
23-26 May 2016, San Jose, CA

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CMOS Emerging Technologies Research (CMOSETR)
25-27 May 2016, Montreal QC, Canada

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Electronic Components and Technology Conference (ECTC)
Several major topics are 3D and 2.5D related
31 May - 3 June 2016, Las Vegas, NV

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The ConFab
12-15 June 2016, Las Vegas, NV

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SEMICON West
12-14 July 2016, San Francisco, CA

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International Wafer-Level Packaging Conference (IWLPC)
18-20 October 2016, San Jose, CA

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IEEE International Conference on 3D System Integration (3D IC)
8-10 November 2016, San Francisco, CA

Recent 3D Events

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IEEE International Solid-State Circuits Conference (ISSCC)
31 January - 4 February 2016, San Francisco, CA

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Pan Pacific Microelectronics Symposium
25-28 January 2016, Big Island, Hawaii

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European 3D Summit 2016, Above and Beyond TSV
18-20 January 2016, Grenoble, France

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3D Architectures for Semiconductor Integration and Packaging (3D ASIP)
15-17 December 2015, Redwood City, CA

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International Electron Devices Meeting (IEDM)
7-9 December 2015, Washington, DC

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Electronic Packaging Technology Conference (EPTC)
2-4 December 2015, Singapore

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SC15: IEEE Supercomputing Conference
(International Conference for High Performance Computing, Networking, Storage and Analysis)
15-20 November 2015, Austin, TX

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MEPTEC/SEMI Symposium, The Great Miniaturization: Systems and Packaging
10-11 November 2015, Santa Clara, CA

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Global Interposer Technology Workshop (GIT)
4-7 November 2015, Atlanta, GA

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Successful Semiconductor Fabless
All about the "More than Moore" supply chain
4-6 November 2015, Paris, France

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ADVANCED CMOS TECHNOLOGY 2015
28-30 October 2015, San Jose, CA

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International Microelectronics Assembly and Packaging (IMAPS)
26-29 October 2015, Orlando, FL

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International Wafer-Level Packaging Conference (IWLPC)
13-15 October 2015, San Jose, CA

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3D TEST (IEEE International Workshop on Testing Three-Dimensional Stacked Integrated Circuits)
8-9 October 2015, Anaheim, CA

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Advanced Packaging Conference (APC): "Interconnects in Miniaturized Systems"
6-8 October 2015, Dresden, Germany

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IEEE SOI-3D-Subthreshold (S3S) Microelectronics Technology Unified Conference
5-8 October 2015, Sonoma Valley, CA

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IMAPS: Advances in Semiconductor Packaging
24 September 2015, Marcy, NY

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Electronics Packaging Symposium: "Technology Advances in Small Scale Systems & Microelectronics Packaging"
15-16 September 2015, Niskayuna, NY

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European Microelectronics and Packaging Conference (EMPC)
14-16 September 2015, Friedrichshafen, Germany

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IEEE International System-on-Chip Conference
8-11 September 2015, Beijing, China

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Image Sensors Americas
8-10 September 2015, Berkeley, CA

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SiP Global Summit (includes day-long 3D IC Technology Forum)
2-4 September 2015, Taipei, Taiwan

2005-2016 3D-IC Alliance. All rights reserved.  Revised: February 08, 2016
 
Contact:  info@3D-IC.org