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Upcoming 3D Events

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SEMICON Taiwan
includes 3D IC & Substrate Pavilion
3-5 September 2014, Taiwan

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IEEE International System-on-Chip Conference
3-5 September 2014, Las Vegas, NV

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Image Sensors Americas
Includes "Stacked Chip Sensors - Is There Any Going Back From Here?"
9-11 September 2014

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Evolving Technologies Summit at SMTA International
29 September 2014, Rosemont, IL

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SEMICON Europa and Advanced Packaging Conference
7-9 October 2014, Dresden, Germany

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International Symposium on Microelectronics (IMAPS)
"The Future of Packaging" - 35+ presentations on interposers and 3D
13-16 October 2014, San Diego, CA

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MemCon
Includes 3D and 2.5D sessions
15 October 2014, Santa Clara, CA

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MEPTEC Semiconductor Packaging Technology Symposium
23 October 2014, Santa Clara, CA

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3D Test Workshop
23-24 October 2014, Seattle, WA

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International Wafer-Level Packaging Conference (IWLPC)
Includes panel: System-level Advantages of 3D Integration
11-13 November 2014, San Jose, CA

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IEEE International Conference on 3D System Integration (3DIC)
1-3 December 2014, Kinsale, Cork, Ireland

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3D Architectures for Semiconductor Integration and Packaging (3D ASIP)
10-12 December 2014, Burlingame, CA

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European 3D TSV Summit
19-21 January 2015, Grenoble, France

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International Solid-State Circuits Conference (ISSCC)
22-26 February 2015, San Francisco, CA

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Design, Automation, and Test in Europe (DATE)
9-13 March 2015, Grenoble, France

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International Symposium on Quality Electronic Design (ISQED)
16-18 March 2015, Santa Clara, CA

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IMAPS Device Packaging Conference
17-19 March 2015, Scottsdale/Fountain Hills, AZ

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Electronic Components and Technology Conference (ECTC)
Several major topics are 3D and 2.5D related
26-29 May 2015, San Diego, CA

Recent 3D Events

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Advanced Packaging & System Integration Technology Symposium
28 August 2014, Wuxi, China

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International Conference on Electronic Packaging Technology (ICEPT)
12-15 August 2014, Chengdu, China

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INFIERI Summer School
15-25 July 2014, Paris, France

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SEMICON West
8-10 July 2014, San Francisco, CA

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Design for 3D Integration (D43D)
23-24 June 2014, Lausanne, Switzerland

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Design Automation Conference (DAC)
1-5 June 2014, San Francisco, CA

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Electronic Components and Technology Conference (ECTC)
27-30 May 2014, Lake Buena Vista, FL

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International Interconnect Technology Conference (IITC) / Advanced Metallization Conference (AMC))
20-23 May 2014, San Jose, CA

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SEMI Advanced Semiconductor Manufacturing Conference (ASMC)
19-21 May 2014, Saratoga Springs, NY

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SEMICON Singapore
3D Integration, TSVs, 3D-IC Technology & Manufacturing 
23-25 April 2014, Singapore

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Electronic Design Process Symposium (EDPS)
Included 3D IC System Stacking
17-18 April 2014, Monterey, CA

© 2005-2014 3D-IC Alliance. All rights reserved.  Revised: September 02, 2014
 
Contact:  info@3D-IC.org