3D-IC Alliance

Home
Standards
Literature
Events
Membership
Search

Upcoming 3D Events

bullet

European MEMS Summit
15-16 September 2016, Stuttgart, Germany

bullet

IMAPS: Advances in Semiconductor Packaging
22 September 2016, Marcy, NY

bullet

International Microelectronics Assembly and Packaging (IMAPS)
10-13 October 2016, Pasadena, CA

bullet

IEEE SOI-3D-Subthreshold (S3S) Microelectronics Technology Unified Conference
10-13 October 2016, Burlingame, CA

bullet

Testing Three-Dimensional Stacked Integrated Circuits (3D-Test)
17-18 November 2016, Fort Worth, TX

bullet

International Wafer-Level Packaging Conference (IWLPC)
18-20 October 2016, San Jose, CA

bullet

Advanced Packaging Conference (part of SEMICON Europa)
25-26 October 2016, Grenoble, France

bullet

IEEE International Conference on 3D System Integration (IEEE 3DIC)
8-10 November 2016, San Francisco, CA

bullet

Semiconductor Packaging Roadmap Symposium
Featuring the new Heterogeneous Integration Roadmap (HIR)
14 November 2016, San Jose, CA

bullet

Electronics Packaging Technology Conference (EPTC)
30 Nov. - 3 Dec. 2016, Singapore

bullet

International Electron Devices Meeting (IEDM)
3-7 December 2016, San Francisco, CA

bullet

3D Architectures for Semiconductor Integration and Packaging (3D ASIP)
13-15 December 2016, San Francisco, CA

bullet

IEEE International Solid-State Circuits Conference (ISSCC)
5-9 February 2017, San Francisco, CA

bullet

Pan Pacific Microelectronics Symposium
6-9 February 2017, Kauai, Hawaii

bullet

IMAPS Device Packaging Conference
6-9 March 2017

bullet

Design, Automation, and Test in Europe (DATE)
27-31 March 2017, Lausanne, Switzerland

bullet

International Symposium on Quality Electronic Design (ISQED)
March 2017, Santa Clara, CA

Recent 3D Events

bullet

SEMICON Taiwan
Advanced packaging named a "hot topic"
7-9 September 2016, Taipei, Taiwan

bullet

IEEE International System-on-Chip Conference
6-9 September 2016, Seattle, WA

bullet

SEMICON West
12-14 July 2016, San Francisco, CA

bullet

2016 Symposia on VLSI Technology and Circuits
13-17 June 2016, Honolulu, HI

bullet

3D Power Electronics Integration and Manufacturing
13-15 June 2016, Raleigh, NC

bullet

The ConFab
12-15 June 2016, Las Vegas, NV

bullet

Electronic Components and Technology Conference (ECTC)
Several major topics are 3D and 2.5D related
31 May - 3 June 2016, Las Vegas, NV

bullet

CMOS Emerging Technologies Research (CMOSETR)
25-27 May 2016, Montreal QC, Canada

bullet

International Interconnect Technology Conference (IITC) / Advanced Metallization Conference (AMC)
23-26 May 2016, San Jose, CA

bullet

Advanced CMOS Technology 2016 (the 20/14/10 nm nodes)
18-20 May 2016, San Jose, CA

bullet

SEMI Advanced Semiconductor Manufacturing Conference (ASMC)
Includes 3D/TSV/Interposer: Packaging and Through Silicon Via
16-19 May 2016, Saratoga Springs, NY

2005-2016 3D-IC Alliance. All rights reserved.  Revised: September 12, 2016
 
Contact:  info@3D-IC.org